Job Summary:
The Camera Hardware Engineering group is responsible for the design, development, and innovation of camera hardware for all related Apple products. Our target is to deliver superior camera hardware to enable best-in-class camera user experience.
We are looking for an enthusiastic, high energy individual who can help us with tomorrow’s challenges.
Major responsibilities:
Model and analyze camera sub-system SI/PI performance and write Python code to automate Ansys simulation tools
Assist senior team members to drive new design characterization, validation and correlation
Collaborate with system team for high speed channel and power delivery network budgeting for camera feature integration
Participate in design feasibility studies for future technologies
Key Qualifications:
Academic or industry exposure to camera or SI/PI technical areas and/or electro-magnetic concepts
Experience on substrate, package or flex/board level SI/PI simulations
Understanding of high speed signal and/or PDN fundamentals
Use of main-stream tool chain e.g HFSS, SI-Wave/PSI, Q3D, CST and ADS
Comfortable to handle VNA/TDR or Oscilloscope in academic or professional settings
Great communication skills to work with x-functional teams
Highly self-motivated and proactive with critical thinking
Preferred skillset
Familiarity with substrate/package material property and selection
Academic knowledge or experience with image sensor or camera module
Proficient in using JMP for statistical analysis
Experience in Python scripting for automating simulation setup
Education: BS/MS/PhD in Electrical Engineering or industrial experience equivalent
Required Skills: QA